Method of making an assembly package in an air tight cavity and

Details Method of making an assembly package in an air tight cavity and Method of making an assembly package in an air tight cavity and

1996-07-03

1998-07-14

Rada, Rinaldi I.

Metal working

Method of mechanical manufacture

Electrical device making

437217, H01L 2331

Patent

active

057785201

ABSTRACT:
A method of making an assembly having an air tight cavity for holding an element therein and having a plurality of thin and flat planar conductive leads extending outwardly from the cavity for providing electrically conductive paths from the element held within the cavity, and a conductive plate for supporting the circuitry, comprising (a) injecting a liquified thermosetting epoxy into a die and solidifying the epoxy by heat curing to form a dielectric frame that is configured such that the inner end and tip portions of the conductive leads are buried in the frame, the flat surfaces of the intermediate portions of the conductive leads are exposed in a common plane and the outer end portions of the conductive leads extend outside the epoxy, (b) bonding the bottom surface of the resulting dielectric frame to the outer periphery of the conductive base plate, (c) plating the exposed flat surfaces of the conductive leads and the conductive base plate with a conductive material, (d) connecting the circuitry disposed within the opening to the conductive base plate and the exposed flat surfaces of the conductive leads and (f) enclosing the resulting connected circuitry to form an air tight cavity.

REFERENCES:
patent: 4862586 (1989-09-01), Osada
patent: 4894704 (1990-01-01), Endo
patent: 5504372 (1996-04-01), Braden et al.
patent: 5557842 (1996-09-01), Bailey
patent: 5569625 (1996-10-01), Yoneda et al.
patent: 5594274 (1997-01-01), Suetaki

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