Multiple row exposed leads for MLP high density packages

Details Multiple row exposed leads for MLP high density packages Multiple row exposed leads for MLP high density packages

2006-08-18

2010-12-07

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S112000, C438S123000, C438S124000, C438S127000

Reexamination Certificate

active

07846774

ABSTRACT:
A leadframe strip production process provides encapsulated semiconductor chips with more than two annular rows of exposed leads by utilizing two types of frames, a leadframe to which IC devices are mounted, and a ring frame strip that is attached to the leadframe with a non-conductive adhesive. The leadframe includes die pads that receive the IC chip devices, and each die pad is positioned within multiple rows of connecting pads for connection with bonding pads of the device to be encapsulated. The connecting pads of the leadframe are arranged in an annular fashion, with inner rows being closer to the die pad and outer rows being farther from the die pad.

REFERENCES:
patent: 6448633 (2002-09-01), Yee et al.
patent: 6797540 (2004-09-01), Li et al.
patent: 6876068 (2005-04-01), Lee et al.
patent: 7015072 (2006-03-01), Combs et al.
patent: 7075816 (2006-07-01), Fee et al.
“Data sheet—MicroLeadFrame QFN Package®”, product description, publication of Amkor Technology, Jul. 2005, pp. 1-2.
“QFN—Quad Flat No-Lead Package”, product description, publication of STATS ChipPAC Ltd., May 2006, pp. 1-2.

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