4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Responsive to non-electrical signal
  6. Electromagnetic or particle radiation

Byoung Young Kang

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Ceramic packaging method employing flip-chip bonding

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Image sensor chip package and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Image sensor chip package and method of fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Method for packaging a semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method for packaging a semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2400228

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