Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-06-12
2007-06-12
Ha, Nathan W. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
active
10751212
ABSTRACT:
A method for packaging a semiconductor device wherein a chip is interconnected with a substrate by performing a flip-chip bonding by using an Au bump formed on a bond pad of the chip. In the method, a wire-bonding process and a molding process using an epoxy molding compound are not required. Further, a process of attaching solder balls to the substrate is not required, which eliminates subsequent flux printing and deflux processes. Accordingly, a packaging process of the semiconductor device becomes simplified and therefore the cost of the semiconductor device is decreased.
REFERENCES:
patent: 6232652 (2001-05-01), Matsushima
patent: 2002/0084521 (2002-07-01), Coyle et al.
patent: 2002/0171157 (2002-11-01), Soga et al.
patent: 2003/0011078 (2003-01-01), Fukao et al.
patent: 2004/0104473 (2004-06-01), Farnworth
patent: 2004/0155357 (2004-08-01), Ho et al.
patent: 2005/0074971 (2005-04-01), Ikumo et al.
patent: 2005/0250303 (2005-11-01), Hsieh et al.
patent: 8-172114 (1996-07-01), None
patent: 2001-332663 (2001-11-01), None
Byoung Young Kang, “Ceramic Packaging Method Employing Flip-Chip Bonding”, U.S. Appl. No. 10/751,209, filed on Dec. 30, 2003.
Kenji Katsuki, Takao Shioyama, Shinji Yoshinaka and Atsuo Sasaki; Binder for Mounting Flip Chip and Manufacturing Method for Semiconductor Device Using the Same; Patent Abstracts of Japan; Publication No. 2001-332683; Publication Date: Nov. 30, 2001.
Takashi Tanaka; Board Correction Method; Patent Abstracts of Japan; Publication No. 08-172114; Publication Date: Jul. 2, 1996.
Dongbu Electronics Co. Ltd.
Fortney Andrew D.
Ha Nathan W.
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