Image sensor chip package and method of fabricating the same

Details Image sensor chip package and method of fabricating the same Image sensor chip package and method of fabricating the same

2008-05-13

2008-05-13

Purvis, Sue A. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S678000, C257S680000, C257S434000, C257SE31117

Reexamination Certificate

active

07372122

ABSTRACT:
The present invention relates to an image sensor chip package and a method for fabricating the same. In one embodiment of an image sensor chip package, chip pads on a first surface of an image sensor chip are attached to electrode pads of a glass substrate with conductive material. In addition, electrode pads are connected to solder balls via a metal wiring pattern arranged on a second surface of the image sensor chip. As a result, the present invention can provide further miniaturized and thinned image sensor chip packages, reduce fabricating processes, and improve device performance and reliability.

REFERENCES:
patent: 6455927 (2002-09-01), Glenn et al.
patent: 6781244 (2004-08-01), Prabhu
patent: 6969632 (2005-11-01), Moden
patent: 7067354 (2006-06-01), Prabhu
patent: 7074632 (2006-07-01), Wada
patent: 7192796 (2007-03-01), Zilber et al.
patent: 2005/0024752 (2005-02-01), Webster

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