4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Bun-Hin Keong

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Chip-sized flip-chip semiconductor package and method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Leadframe for use in a semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3148812

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