Chip-sized flip-chip semiconductor package and method for...

Details Chip-sized flip-chip semiconductor package and method for... Chip-sized flip-chip semiconductor package and method for...

2006-07-12

2009-11-10

Fahmy, Wael (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257S778000, C257SE21502, C438S113000

Reexamination Certificate

active

07615410

ABSTRACT:
A semiconductor package (10; 14) comprises a semiconductor die (2; 2′) with a plurality of contact areas (4) on its active surface and an electrically conductive bump (7) on each contact area (4). The die (2; 2′) and electrically conductive bumps (7) are encapsulated in a plastic housing (11) so that the plastic housing (11) encapsulates at least sides of the die (2; 2′) and sides of the electrically conductive bumps (7).

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