4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Brian Harden

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Method of dicing wafer level integrated multiple optical element

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Wafer level creation of multiple optical elements

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Wafer level creation of multiple optical elements

Optical: systems and elements – Single channel simultaneously to or from plural channels – By surface composed of lenticular elements
Reexamination Certificate

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Profile ID: LFUS-PAI-P-881566

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