Wafer level creation of multiple optical elements

Details Wafer level creation of multiple optical elements Wafer level creation of multiple optical elements

2005-01-18

2005-01-18

Mack, Ricky (Department: 2873)

Optical: systems and elements

Single channel simultaneously to or from plural channels

By surface composed of lenticular elements

C264S001100, C216S026000

Reexamination Certificate

active

06844978

ABSTRACT:
Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

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