Method of dicing wafer level integrated multiple optical element

Details Method of dicing wafer level integrated multiple optical element Method of dicing wafer level integrated multiple optical element

1997-10-03

2000-08-01

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

438460, H01L 2178

Patent

active

060961554

ABSTRACT:
Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.

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patent: 4769108 (1988-09-01), Deppe et al.
patent: 5034083 (1991-07-01), Campanelli et al.
patent: 5157001 (1992-10-01), Sakuma
patent: 5182055 (1993-01-01), Allison et al.

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