Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1989-08-28
1990-12-18
Heinrich, Sam
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
228175, 228254, 156325, 65 591, 29832, H01L 2314, B23K10140
Patent
active
049780522
ABSTRACT:
A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component is disposed between the substrate and the semiconductor die to withstand stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed to the substrate with a layer of solder. The layer of solder is provided to dissipate stresses created by thermal cycling of the substrate and the die. The die is sealed to the buffer with a silver-glass adhesive.
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Cherukuri Satyam C.
Fister Julius C.
Mahulikar Deepak
O'Donnelly Brian E.
Heinrich Sam
Olin Corporation
Rosenblatt Gregory S.
Weinstein Paul
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