4. Etching a substrate: processes
  5. Nongaseous phase etching of substrate
  6. Irradiating, ion implanting, alloying, diffusing, or...

Brian A. Carlson

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Apparatus and method for flip-chip bonding

Metal fusion bonding – Process – Plural joints
Patent

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Apparatus and method for flip-chip bonding

Metal fusion bonding – Process – Plural joints
Patent

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Apparatus and method for flip-clip bonding

Metal fusion bonding – Process – Plural joints
Patent

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Conductive amorphous-nitride barrier layer for high dielectric-c

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material
Patent

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Conductive exotic-nitride barrier layer for high-dielectric-cons

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Patent

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