Metal fusion bonding – Process – Plural joints
Patent
1994-01-04
1994-12-06
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural joints
269 8, 228 443, 228212, H01L 2160
Patent
active
053703014
ABSTRACT:
A bonding apparatus (40) is provided for use in coupling a first substrate (20) with flip chip type interconnections (24) to a second substrate (22) having matching flip chip type interconnections (26). The bonding apparatus (40) includes a pedestal assembly (50) which may be used to align and couple the first substrate (20) with the second substrate (22) and transport the substrates (20 and 22) from the bonding apparatus (40) to a heater assembly (110). Magnetic force is used to maintain the alignment of the first substrate (20) with the second substrate (22) during temperature cycling within the heater assembly. The pedestal assembly (50) includes a magnet slidably disposed on the exterior of the pedestal assembly (50). For some applications, the magnet (60) may be formed from one or more permanent magnets. For other applications, magnet (60) may be formed from one or more electromagnets.
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Andrews Gary W.
Belcher James F.
Carlson Brian A.
Donaldson Richard L.
Kesterson James C.
Ramsey Kenneth J.
Texas Instruments Incorporated
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