Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
Inventor
active
Die-up ball grid array package with attached stiffener ring
Die-up ball grid array package with patterned stiffener opening
Die-up ball grid array package with printed circuit board...
Fixture for lid-attachment for encapsulated packages
PBGA stiffener package
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Profile ID: LFUS-PAI-P-974477