Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent
1997-05-21
2000-05-30
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
438106, 438121, 438123, H01L 2144, H01L 2148, H01L 2150
Patent
active
060690275
ABSTRACT:
An electronic semiconductor device package, the package having: a substrate having a top and bottom surface and having traces; a die attached to the top surface of the substrate; first level interconnects of the die to the traces of the substrate; encapsulant which covers the die and first level interconnects; and a lid attached to the encapsulant, wherein the lid comprises at least one lid support which extends from the lid to the substrate. A fixture for attaching a lid to an electronic semiconductor device package, the package having: a substrate having a top surface and a bottom surface and having traces, a die attached to the top surface of the substrate, first level interconnects of the die to the traces of the substrate, and the fixture having: an interior opening for receiving the lid and package, wherein the interior opening comprises first and second walls, wherein the first wall of the interior opening corresponds to an outside dimension of the substrate and wherein the second wall corresponds to an outside dimension of the lid. A method of attaching a lid to an electronic semiconductor device package, the package having: a substrate having a top surface and a bottom surface and having traces, a die attached to the top surface of the substrate, first level interconnects of the die to the traces of the substrate, and the method having: inserting a lid into a fixture, wherein the fixture comprises an interior opening for receiving the lid and package wherein the interior opening has a first wall corresponding to a dimension of the substrate and a second wall corresponding to a dimension of the lid; applying adhesive between the lid and package; and inserting a package into the fixture.
REFERENCES:
patent: 5455456 (1995-10-01), Newman
patent: 5837562 (1998-11-01), Cho
Bacher Brent
Mertol Atila
Collins D. Mark
LSI Logic Corporation
Picardat Kevin M.
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