4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

Benzhen Yuan

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High density multi-layered printed wiring board, multi-chip carr

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent

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Pretreating solution for electroless plating, electroless platin

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener
Patent

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Pretreating solution for electroless plating, electroless...

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1627138

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