Pretreating solution for electroless plating, electroless platin

Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener

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427305, 427327, 427405, 427437, 4274431, B05D 310, B05D 118, B05D 136

Patent

active

061467006

ABSTRACT:
As an electroless plating technique capable of surely promoting the plating reaction without Pd substitution reaction and fastening the plating deposition, there are proposed an electroless plating method of subjecting a primary plated film (or metal film) formed on a substrate to a secondary plating (or electroless plating), characterized in that the secondary plating is carried out after a surface potential of the primary plated film is adjusted so as to be more base than such a most base surface potential that a surface current density of the primary plated film is zero in an electroless plating solution for the secondary plating; and a pretreating solution for electroless plating comprising an alkali solution, reducing agent and complexing agent; and an electroless plating bath suitable for use in this method.

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