Etching a substrate: processes – Nongaseous phase etching of substrate – Substrate is multilayered
Patent
1994-03-28
1997-04-15
Fourson, George
Etching a substrate: processes
Nongaseous phase etching of substrate
Substrate is multilayered
252 793, 216107, C23F 102, H01L 2100
Patent
active
056205589
ABSTRACT:
The linewidth in patterns produced by etching copper layers is more easily maintained using a specific etching medium. In particular, this medium includes aqueous hydrofluoric acid, copper chloride, and an additional chloride salt. The etching medium is also particularly useful for bilayer metal constructions such as the copper/titanium structure found in many multichip modules.
REFERENCES:
patent: 3890177 (1975-06-01), Pfahnl et al.
patent: 4345969 (1982-08-01), James et al.
patent: 4900398 (1990-02-01), Chen
patent: 5017271 (1991-05-01), Whewell et al.
patent: 5049234 (1991-09-01), Madhusudhan
patent: 5248386 (1993-09-01), Dastolfo, Jr. et al.
patent: 5298117 (1994-03-01), Hanson et al.
Hanson Karrie J.
Miller Barry
Sapjeta Barbara J.
Shah Akshay V.
Takahashi Ken M.
Everhart C.
Fourson George
Lucent Technologies - Inc.
Schneider Bruce S.
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