4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Atsushi Hirakawa

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Method and device for applying sealant to component

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate

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Sealing structure and method of sealing electronic component

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Patent

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Sealing structure and method of sealing electronic component

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Surface acoustic wave device having a package including a...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1288688

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