Sealing structure and method of sealing electronic component

Details Sealing structure and method of sealing electronic component Sealing structure and method of sealing electronic component

1997-08-25

1999-03-23

Budd, Mark O.

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

310348, H01L 4108

Patent

active

058864571

ABSTRACT:
A sealing structure and a sealing method for an electronic component achieves desired sealing properties and heat resistance. An electronic component element is mounted on a substrate having an electrode pattern disposed thereon, and is sealed by bonding a cap for covering the electronic component element on the substrate. An adhesive structure used to join the cap on the substrate includes a high-glass-transition-point adhesive partially coated on the cap bonded portion of the substrate, and a low-glass-transition-point adhesive coated over an entire periphery of the opening of the cap. The opening of the cap is pressed on a mounting portion of the substrate, and the adhesives are then cured to bond and seal the substrate and the cap.

REFERENCES:
patent: 4293986 (1981-10-01), Kobayashi et al.
patent: 4362961 (1982-12-01), Gerber
patent: 5585687 (1996-12-01), Wakabayashi et al.

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