Sealing structure and method of sealing electronic component

Details Sealing structure and method of sealing electronic component Sealing structure and method of sealing electronic component

1998-09-02

2000-04-11

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156292, H01L 2102

Patent

active

060484330

ABSTRACT:
A sealing structure and a sealing method for an electronic component achieves desired sealing properties and heat resistance. An electronic component element is mounted on a substrate having an electrode pattern disposed thereon, and is sealed by bonding a cap for covering the electronic component element on the substrate. An adhesive structure used to join the cap on the substrate includes a high-glass-transition-point adhesive partially coated on the cap bonded portion of the substrate, and a low-glass-transition-point adhesive coated over an entire periphery of the opening of the cap. The opening of the cap is pressed on a mounting portion of the substrate, and the adhesives are then cured to bond and seal the substrate and the cap.

REFERENCES:
patent: 3735211 (1973-05-01), Kapnias
patent: 4977009 (1990-12-01), Anderson et al.

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