4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Atin J. Patel

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Method and structure for balancing encapsulation stresses in a h

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Multi-level thin film capacitor on a ceramic substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Multi-level thin film capacitor on a ceramic substrate and...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Three dimensional packaging configuration for multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Profile ID: LFUS-PAI-P-408398

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