Method and structure for balancing encapsulation stresses in a h

Details Method and structure for balancing encapsulation stresses in a h Method and structure for balancing encapsulation stresses in a h

1994-12-21

1996-06-18

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 174 35R, 174 522, 257706, 257713, 257730, 257787, 361715, 361717, 361816, H05K 720

Patent

active

055284574

ABSTRACT:
A method and a structure for reducing the stresses arising in a hybrid circuit from the interface between the encapsulant and the substrate. An additional layer, preferably of the same material as the substrate, is added to the outside surface of the encapsulant. The purpose of the layer is to provide a second opposing surface to balance and thereby reduce the stress originating from the encapsulant/substrate interface. The second layer is applied prior to the curing of the encapsulant material.

REFERENCES:
patent: 5355016 (1994-10-01), Swirbel et al.
IBM Technical Disclosure Bulletin, "Maximum Heat Transfer Medium", Berndlmaier et al, vol. 20, No. 11A, Apr. 1978, pp. 4389-90.

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