4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

Arthur K. Lin

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active

Grounding of package substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Method of dissipating static electric charge from a chip...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method of forming an integrated circuit substrate

Semiconductor device manufacturing: process – Making device array and selectively interconnecting
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2613038

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