Method of forming an integrated circuit substrate

Details Method of forming an integrated circuit substrate Method of forming an integrated circuit substrate

2005-02-22

2005-02-22

Gurley, Lynne A. (Department: 2812)

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

C438S129000, C438S612000, C438S614000, C438S674000

Reexamination Certificate

active

06858475

ABSTRACT:
A method of forming an integrated circuit substrate that may be adapted to be attached to one or more electronic components. The method includes applying a resist to a back side of a substrate which includes patterned conductive layers on a front side and a back side of the substrate. The method further includes removing part of the patterned conductive layer from the front side of the substrate to form pads and interconnects on the front side of the substrate and applying another resist to the front side of the substrate. The method also includes forming a pattern in each resist that exposes the pads on the front and back sides of the substrate and applying electrolytic nickel to the pads on the substrate.

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