Process for manufacturing integrated device with improved connec

Details Process for manufacturing integrated device with improved connec Process for manufacturing integrated device with improved connec

1992-04-13

1992-11-24

Seidel, Richard K.

Metal fusion bonding

Process

Plural diverse bonding

228179, 228111, B23K 2010, B23K10140

Patent

active

051655900

ABSTRACT:
A process for manufacturing devices with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads and with high reliability of the connections, the connecting wires are made of different materials. Advantageously, the wires for the power connections are based on aluminum and have large diameters, and the wires for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends of the pins on which the connecting wires are to be soldered are gold-plated.

REFERENCES:
patent: 4458297 (1984-07-01), Stopper et al.
patent: 4818895 (1989-04-01), Kaufman
patent: 4942455 (1990-07-01), Shinohara

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