4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Alvin M. W. Kong

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Method of thin film patterning by reflow

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Thin film voltage-tuned semiconductor bulk acoustic resonator (S

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Patent

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Profile ID: LFUS-PAI-P-786552

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