Method of thin film patterning by reflow

Details Method of thin film patterning by reflow Method of thin film patterning by reflow

1995-02-16

1996-11-12

Heinrich, Samuel M.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

2281246, 228195, 228254, 427123, H01L 2150, H01L 2152

Patent

active

055731716

ABSTRACT:
A method of thin film patterning by reflow. A first metal trace is deposited onto a surface of a substrate in a predetermined pattern. A second metal trace is then deposited onto the deposited first metal trace. Next, a thin film of a third metal is deposited onto the entire surface of the substrate and onto the deposited first and second metal traces. The substrate and the associated deposited metals are then heated to cause the deposited thin film of the third metal to flow and bead onto the second metal trace.

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