4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Alfred Kemper

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Method and device for producing a soldered joint

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate

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Method for the structured application of a laminatable film...

Data processing: generic control systems or specific application – Specific application – apparatus or process – Specific application of temperature responsive control system
Reexamination Certificate

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Power semiconductor module and method for producing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Power semiconductor module with ceramic substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – With housing or external electrode
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2172762

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