Method for the structured application of a laminatable film...

Details Method for the structured application of a laminatable film... Method for the structured application of a laminatable film...

2006-10-12

2010-06-22

Patel, Ramesh B (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Specific application of temperature responsive control system

C257S666000, C257S667000, C257S668000, C257S700000, C257S703000, C216S065000, C216S083000

Reexamination Certificate

active

07742843

ABSTRACT:
A method for structured application of a laminatable intermediate layer (9) to a substrate (1) for a semiconductor module, wherein a separating layer is indirectly or directly applied to the substrate (1) over a large surface, the intermediate layer (9) is applied to the substrate (1), including the separating layer(s), by lamination, over a large surface, the intermediate layer (9) is opened in places on the substrate (1), where recesses are provided for the intermediate layer (9), and the separating layer (8) is removed in these places.

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International Search Report and Written Opinion for International Patent Application No. PCT/EP2005/003325, filed Mar. 30, 2005 (13 pages), Mailing Date Nov. 24, 2005.

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