Power semiconductor module and method for producing the same

Details Power semiconductor module and method for producing the same Power semiconductor module and method for producing the same

2011-07-26

2011-07-26

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE21499, C257SE21500, C257SE23009, C257SE23023, C438S106000

Reexamination Certificate

active

07986034

ABSTRACT:
A method for producing a power semiconductor module including forming a contact between a contact region and a contact element as an ultrasonic welding contact via a sonotrode. The ultrasonic welding operation also being used for joining the contact regions with the contact ends and consequently for joining the contacts and the foot regions.

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