4. Machines not elsewhere specified
  5. Material working, abrading, or founding machinery
  6. Cutting

Akio Kawakita

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Roller for a wire saw for semiconductors

Machines not elsewhere specified – Material working – abrading – or founding machinery – Cutting
Patent

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Wafer processing system

Cleaning and liquid contact with solids – Processes – Work handled in bulk or groups
Patent

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Wire saw and work slicing method

Stone working – Sawing – Reciprocating
Patent

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Profile ID: LFUS-PAI-P-1063254

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