Wafer processing system

Details Wafer processing system Wafer processing system

1996-09-04

1999-09-14

Stinson, Frankie L.

Cleaning and liquid contact with solids

Processes

Work handled in bulk or groups

134 76, 134902, 134201, 134 61, 134 63, 134 59, B08B 304

Patent

active

059506431

ABSTRACT:
A processing system for processing of wafers that are formed by slicing a cylindrical workpiece which is adhered to a support plate by an adhesive agent. The processing system includes a washing apparatus, a removing apparatus, a separating apparatus, and a transferring apparatus. The washing apparatus washes the wafers that are remained adhered to the support plate. The removing apparatus removes a group of the wafers from the support plate. The removed wafers are gathered in a cylindrical shape. The separating apparatus separates the wafers one by one. The separating apparatus includes a vessel for accommodating the wafers separated one from another. The transferring apparatus transfers the wafers from the washing apparatus to the removing apparatus and then to the separating apparatus.

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