Machines not elsewhere specified – Material working – abrading – or founding machinery – Cutting
Patent
1997-08-12
1998-11-17
Davis, Antoine Duval
Machines not elsewhere specified
Material working, abrading, or founding machinery
Cutting
D15138, 1509
Patent
active
D04012496
REFERENCES:
patent: D369361 (1996-04-01), Satake
patent: 5715807 (1998-02-01), Toyama et al.
Davis Antoine Duval
Nippei Toyama Corporation
LandOfFree
Roller for a wire saw for semiconductors does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Roller for a wire saw for semiconductors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Roller for a wire saw for semiconductors will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-872505