4. Semiconductor device manufacturing: process
  5. Semiconductor substrate dicing
  6. With attachment to temporary support or carrier

Akihiro Niimi

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Metallic electrode forming method and semiconductor device...

Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate

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Method for manufacturing mold type semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Mold type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Package type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2320137

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