Metal fusion bonding – Including means to apply flux or filler to work or applicator – Solid flux or solid filler
Reexamination Certificate
2005-08-09
2005-08-09
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Including means to apply flux or filler to work or applicator
Solid flux or solid filler
C228S033000, C228S040000, C228S246000
Reexamination Certificate
active
06926188
ABSTRACT:
Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.
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English Version of China Patent Publication No. 460355 (publication date: Oct. 21, 2001).
Futakami Kazuhiko
Hazeyama Ichiro
Ishida Jun
Katahira Akeo
Kitajo Sakae
Choate Hall & Stewart LLP
Edmondson Lynne R.
Japan E.M. Co., Ltd.
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