4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

Ah Lek Hu

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Cooling for singulation of composite materials in molded...

Refrigeration – Processes – Treating an article
Reexamination Certificate

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Electrical isolation in panels of leadless IC packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Enhanced solder joint strength and ease of inspection of...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Enhanced solder joint strength and ease of inspection of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Locking lead tips and die attach pad for a leadless package...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2430588

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