Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2005-03-29
2005-03-29
Elms, Richard (Department: 2824)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S015000, C438S016000, C438S017000
Reexamination Certificate
active
06872599
ABSTRACT:
Methods of fabricating leadless packages are described that provide good solder joint reliability. In most respects, the packages are fabricated in a manner similar to current lead frame based leadless packaging techniques. However, at some point in the process, the contacts are provided with undercut regions that are left exposed during solder plating so that the solder plating also covers the exposed side and undercut segments of the contacts. When the resultant devices are soldered to an appropriate substrate (after singulation), each resulting solder joint includes a fillet that adheres very well to the undercut portion of contact. This provides a high quality solder joint that can be visually inspected from the side of the package.
REFERENCES:
patent: 5998234 (1999-12-01), Murata et al.
patent: 6083776 (2000-07-01), Manteghi
patent: 6229200 (2001-05-01), Mclellan et al.
patent: 6242281 (2001-06-01), Mclellan et al.
patent: 6278618 (2001-08-01), Lee et al.
patent: 6372539 (2002-04-01), Bayan et al.
patent: 6399415 (2002-06-01), Bayan et al.
patent: 6400004 (2002-06-01), Fan et al.
patent: 6410363 (2002-06-01), Tani et al.
patent: 6448107 (2002-09-01), Hong et al.
patent: 6511863 (2003-01-01), Farnworth et al.
patent: 6603194 (2003-08-01), Utsumi et al.
patent: 6617197 (2003-09-01), Bayan et al.
patent: 6723585 (2004-04-01), Tu et al.
patent: 6777800 (2004-08-01), Madrid et al.
patent: 6797540 (2004-09-01), Li et al.
patent: 20010030355 (2001-10-01), Mclellan et al.
patent: 20030230792 (2003-12-01), Wu et al.
patent: 20040207054 (2004-10-01), Brown et al.
Bayan Jaime A.
Hu Ah Lek
Li Felix C.
Nadarajah Santhiran
Beyer Weaver & Thomas LLP
Elms Richard
Luhrs Michael K.
National Semiconductor Corporation
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