4. Metal fusion bonding
  5. Including means to apply flux or filler to work or applicator
  6. By partial or total immersion of work or applicator into liquid

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Flux-application fixture for a ball-grid-array (BGA)...

Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Reexamination Certificate

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Method and apparatus for memory module circuit interconnection

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Method and apparatus for protecting and strengthening...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Method and apparatus for reducing IC die mass and thickness...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Combined with the removal of material by nonchemical means
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