Method and apparatus for memory module circuit interconnection

Details Method and apparatus for memory module circuit interconnection Method and apparatus for memory module circuit interconnection

2006-09-12

2006-09-12

Duverne, Jean (Department: 2859)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

Reexamination Certificate

active

07104804

ABSTRACT:
An IC package for mounting to a surface of a device board includes a first IC having a first surface supporting a first plurality of conductive leads extending orthogonally from the first surface, a second IC having a second surface supporting a second plurality of conductive leads extending orthogonally from the second surface, the first and second ICs spaced apart in parallel with the first and second surfaces facing, and an interposer trace board parallel to the first and second ICs and positioned between the first and second ICs, the trace board having conducting metal traces on a non-conductive sheet material, the traces accessible from both sides of the trace board, being exposed at selected regions through the non-conductive sheet. The package is characterized in that the conductive traces contact individual ones of the first and second pluralities of conductive leads, providing conductive signal paths from the first and second ICs between the ICs and leading to edges of the IC package.

REFERENCES:
patent: 5531022 (1996-07-01), Beaman et al.
patent: 5810607 (1998-09-01), Shih et al.
patent: 6097609 (2000-08-01), Kabadi
U.S. patent application Ser. No. 09/625,693, Ong, pending.
U.S. patent application Ser. No. 09/609,626, Ong, pending.

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