4. Radiant energy
  5. Ionic separation or analysis
  6. Static field-type ion path-bending selecting means

A. James Hughes

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High density 3-D integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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High density 3-D integrated circuit package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Image sensor having improved moving target discernment capabilit

Radiant energy – Ionic separation or analysis – Static field-type ion path-bending selecting means
Patent

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Profile ID: LFUS-PAI-P-1008303

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