4. Geometrical instruments
  5. Gauge
  6. Collocating

1st Silicon (Malaysia) SDN BHD

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Method for forming bond pad openings

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Overlay vernier

Geometrical instruments – Gauge – Collocating
Reexamination Certificate

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Soft-landing etching method using doping level control

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate

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