Electronic packaging with varying height connectors

Details Electronic packaging with varying height connectors Electronic packaging with varying height connectors

1991-02-11

1992-12-22

Laroche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257673, 257735, 257737, 257780, H01L 2160, H01L 2312

Patent

active

051737639

ABSTRACT:
In joining conductors at different levels on a carrier to contact locations on a planar substrate, mound shaped connections are employed, with the height of each mound shaped connection extending to the level of the particular conductor to which it is bonded. The mound shaped connections are formed using planar processes of controlled volume deposition, surface tension shaping on reflow, and physical deformation. The height of the mound shaped connections are calculated empirically from the volume deposited bounded by the substrate pad after surface tension limits the slump on reflowing.

REFERENCES:
patent: 3458925 (1969-08-01), Napier et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 4912547 (1990-03-01), Bilowith et al.
patent: 4999700 (1991-03-01), Dunaway et al.
IBM Technical Disclosure Bulletin, vol. 22, No. 7, Dec. 1979, pp. 2734-2735 "Double Mask System For Solder Bump Formation" by P. A. Totta.
IBM Technical Disclosure Bulletin, vol. 20, No. 4, Sep. 1977, p. 1894 "Dummy Pads For Increased Creep Resistance" by R. Herdzik et al.

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