Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1991-08-14
1993-10-26
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257733, 174 163, 165 803, 361702, H01L 2302, H01L 3902
Patent
active
052569020
ABSTRACT:
A heat-sink cooling apparatus and a method for attaching a heatsink to a ceramic integrated-circuit package are provided. An externally-threaded molybdenum stud is attached to and extends from a copper/tungsten slug, or attachment plate, which is brazed to the ceramic integrated-circuit package. The stud and the slug have similar thermal coefficients of expansion to reduce thermal stress at the interface therebetween. An aluminum heatsink has an internally threaded hole formed therein for receiving the externally-threaded molybdenum stud. The external threads of the harder molybdenum material engage and deform the threads formed in the aluminum heatsink to provide strong mechanical and thermal bonding between the stud and the heatsink.
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Microelectronics Packaging Handbook edited by Rao Tummala et al., Van Nostrand Reinhold Publishing Company, 1989, pp. 36-37, 48-51, 744 and 745.
Hille Rolf
King Patrick T.
Ostrowski David
VLSI Technology Inc.
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