Protective film for fuse window passivation for semiconductor in

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

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257640, 257665, H01L 2702

Patent

active

057290415

ABSTRACT:
An integrated circuit includes a conductive fusible link that may be blown by heating with laser irradiation, The integrate circuit comprises a silicon substrate; a first insulating layer; a fusible link on the first layer; a second insulating layer overlying the first layer and the fusible link; an opening through the second layer exposing the fuse; and a protective layer over the surfaces of the opening. A laser beam is irradiated through the opening and the protective layer to melt the fusible link. The protective layer is highly transparent to a laser beam and does not interfere with the laser melting (trimming) operation. Moreover, the protective layer prevents contaminates from diffusing in through the opening to harm adjacent semiconductor devices,

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