Protective coating combination for lead frames

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Forming multiple superposed electrolytic coatings

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205122, 205176, C25D 510, H01L 23495

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057282854

ABSTRACT:
A lead frame for a semiconductor device includes a base which is coated by a protective coating. The lead frame base is made of a ferrous material. The protective coating is made by sequentially electroplating a copper-containing layer, a silver-containing layer and a palladium-containing layer. Protective coatings constructed in this way are bondable, solderable, oxidation resistant, corrosion resistant, free of lead (Pb), resistant to high temperatures, cost effective, and cosmetically acceptable. It is also possible to use a layer of tin or a tin alloy in place of the silver layer.

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Donald C. Abbott et al., Palladium as a Lead Finish for Surface Mount Integrated Circuit Packages; Texas Instruments Incorporated, Dallas, Texas, frm IEPC Proceedings, Sep. 1990, pp. 110-119.

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