Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1986-06-16
1994-08-16
Kittle, John E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430495, 430945, 21912162, 21912169, 21912179, 21912184, G03C 500, G03C 100, B23K 900
Patent
active
053386450
ABSTRACT:
Printed circuits which reside on three dimensional surfaces are disclosed. Using a first technique, a three dimensional surface is formed on a substrate having a high melting point or permitting a high degree of infrared energy transmittance. The surface contains a layer of metalization maintained at a depth of less than two microns. An infrared laser then moves around the surface and selectively vaporizes metalization leaving a desired printed circuit pattern. The remaining metalization is plated to a useable depth. Using a second technique, a fiber optic bundle is machined on one end to mate with the three dimensional surface. The three dimensional surface, metalized and coated with photo resist, resides in intimate contact with this first end. A second end of the cable is flat and resides in intimate contact with two dimensional master photo artwork. A pattern is exposed on the photoresist through the fiber optic bundle, and the metalization is etched using conventional techniques.
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patent: 4535218 (1985-08-01), Krause et al.
Techniques of Adjusting Thin- and Thick-Film Resistors in Hybrid Microelectronic Circuits, Awatar Singh, Microelectronics, vol. 15, No. 2, 123-129.
Focused Laser Lithographic System, Becker et al., Applied Optics, vol. 17, No. 7, Apr. 1, 1978, pp. 1069-1071.
Laser Machining of Thin Films and Integrated Circuits, Cohen et al., Bell Systems Technical Journal, Mar. 1968, pp. 385-404.
Laser Exposes PCB's, Decker, Circuits Manufacturing, pp. 11-24, Dec. 1979.
Cote Kenneth C.
Henderson James M.
Scott Vernon R.
Gresham Lowell W.
Kittle John E.
Motorola Inc.
Ryan Patrick J.
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