Multi-tier laminate substrate with internal heat spreader

Details Multi-tier laminate substrate with internal heat spreader Multi-tier laminate substrate with internal heat spreader

1995-03-13

1997-01-28

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428131, 174255, 361688, 361711, 361712, 361737, B32B 900

Patent

active

055976433

ABSTRACT:
A multi-tier laminate substrate with an internal heat spreader and method for making a multi-tier laminate substrate with an internal heat spreader for electronic device packaging are provided wherein a spacing mechanism is used to protect the bond fingers of a trace on a lower tier of the laminated substrate when a milling bit is used to cut an opening above a die cavity in the multi-tier substrate,.

REFERENCES:
patent: 4677526 (1987-06-01), Muehling
patent: 4972253 (1990-11-01), Palino et al.
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 5089878 (1992-02-01), Lee
patent: 5102829 (1992-04-01), Cohn
patent: 5191511 (1993-03-01), Sawaya
Ron Iscoff; "Hestia Technologies Begin High Performance PQFP Deliveries"; Semiconductor International; Jun., 1990.
"HDP User Group/SEMI Packaging Array Workshop"; Cambridge, Mass.; Jun. 14, 1993.

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