Wafer test and burn-in platform using ceramic tile supports

Details Wafer test and burn-in platform using ceramic tile supports Wafer test and burn-in platform using ceramic tile supports

1997-06-26

2000-02-01

Brown, Glenn W.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324754, 324760, G01R 1073, G01R 3102

Patent

active

060207507

ABSTRACT:
A plurality of multilayer glass-ceramic substrates are arranged in coplanar relationship in a tile pattern within a support platform. The glass-ceramic substrates and the support platform are both formed of materials having thermal expansion characteristics substantially equal to that of a wafer which is supported by the coplanarly aligned substrates during test and burn-in of the wafer. The present invention effectively solves the problem of providing a single large support member for wafer test and burn-in, which heretofore have been limited in mechanical properties and power capability.

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"Postage Stamp Lamination of Reworkable Interposers for Direct Chip Attach," IBM Technical Disclosure Bulletin, vol. 36, No. 12, Dec. 1993, pp. 487-488.

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