Apparatus for forcing plating solution into via openings

Details Apparatus for forcing plating solution into via openings Apparatus for forcing plating solution into via openings

1995-02-15

1997-01-28

Edwards, Laura

Coating apparatus

With vacuum or fluid pressure chamber

118407, 118429, C23C 1800

Patent

active

055974120

ABSTRACT:
A method and apparatus for filling small diameter, high aspect ratio via openings with a plating solution are disclosed. An apparatus according to the invention comprises a sealable chamber for receiving one or more a multichip module substrate comprising via openings to be plated. A vacuum pump is used to evacuate the chamber after the substrate(s) are positioned therein and the chamber has been sealed. Plating solution is then introduced into the chamber to immerse the substrate(s), and the solution is pressurized, forcing the liquid into the via openings. In one preferred embodiment, the chamber comprises two subchambers separated by a flexible wall. After the subchamber holding the substrate(s) has been evacuated and filled with plating solution, the other subchamber is pressurized, as with compressed air, such that a force is applied to the flexible wall creating hydrostatic pressure within the first subchamber.

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